We are excited to announce that Kingka will be exhibiting at PCIM Europe 2025, one of the leading events in the field of power electronics. This year, the exhibition will take place from May 6-8, 2025, in Nuremberg, Germany.At our booth (No: 6-123), we will showcase our latest advancements in therma Read More

On November 15th, we concluded our exhilarating participation at the prestigious Electronica Munich Expo 2024, a global gathering that brought together the brightest minds and most innovative technologies in the electronics industry. Our company was thrilled to showcase our cutting-edge products and Read More

In the era of high-density computing, virtual validation has become a mandatory prerequisite to physical manufacturing. This article explores how a thermal simulation heat sink approach—leveraging ANSYS FEM—resolves critical cooling challenges in high-power CPU and telecommunications systems. Authored by Kingka, an industry leader with 15+ years of experience and 25+ years of R&D expertise, the guide analyzes the impact of material selection (Aluminum ~200 W/m·K vs. Copper ~400 W/m·K) and complex geometries like high-density skived fins on overall thermal resistance. Through detailed case studies, we demonstrate how predictive modeling reduces development costs by eliminating tooling revisions and optimizing airflow paths before a single piece of metal is cut. The post concludes by emphasizing the necessity of closed-loop validation, where in-house lab testing is used to verify simulated data, ensuring absolute reliability for mission-critical electronic cooling applications. Read More