AI Liquid Cooling: Copper vs. Aluminum Consumption in High-Performance GPUs As AI clusters push power densities beyond the limits of air cooling, the demand for high-purity copper and lightweight aluminum has reached a critical junction. This article analyzes the technical trade-offs between these two essential metals within liquid-cooled environments. From the perspective of Kingka Tech’s Chief Manufacturing Engineer, we move beyond market speculation to address real-world engineering challenges: how to utilize copper’s thermal conductivity at the heat source without incurring the weight and cost penalties of an all-copper system. We explore hybrid design strategies—integrating copper micro-channels with aluminum manifolds—and discuss how precision CNC machining and advanced bonding techniques ensure long-term reliability in high-pressure data center environments. This guide provides B2B procurement managers and designers with a data-driven framework for selecting material compositions that optimize for both thermal performance and total cost of ownership (T
Read More