We are excited to announce that Kingka will be exhibiting at PCIM Europe 2025, one of the leading events in the field of power electronics. This year, the exhibition will take place from May 6-8, 2025, in Nuremberg, Germany.At our booth (No: 6-123), we will showcase our latest advancements in therma Read More

On November 15th, we concluded our exhilarating participation at the prestigious Electronica Munich Expo 2024, a global gathering that brought together the brightest minds and most innovative technologies in the electronics industry. Our company was thrilled to showcase our cutting-edge products and Read More

In high-power electronics where heat flux exceeds 50 W/cm², conventional cooling often hits a physical wall. This article explores the engineering boundaries of the Skiving Fin Heat Sink, specifically focusing on how ultra-thin fin geometries (down to 0.05 mm) and extreme aspect ratios (50:1) enable superior thermal management. Authored by the engineering team at Kingka Tech, the post provides a deep dive into material-specific constraints—comparing the structural stability of Copper (0.1–0.6 mm) versus Aluminum (0.2–1.2 mm) fins. Through a detailed case study of an industrial IGBT module, we demonstrate how transitioning to a custom skived design with 0.1 mm fins reduced operating temperatures by 8–12°C. The guide concludes with practical advice on balancing fin density with pressure drop and a comprehensive FAQ to assist designers in specifying the most efficient monolithic cooling solution for their specific application. Read More