We are excited to announce that Kingka will be exhibiting at PCIM Europe 2025, one of the leading events in the field of power electronics. This year, the exhibition will take place from May 6-8, 2025, in Nuremberg, Germany.At our booth (No: 6-123), we will showcase our latest advancements in therma Read More

On November 15th, we concluded our exhilarating participation at the prestigious Electronica Munich Expo 2024, a global gathering that brought together the brightest minds and most innovative technologies in the electronics industry. Our company was thrilled to showcase our cutting-edge products and Read More

In the era of 700W+ GPUs, the linear conduction of pure aluminum is no longer sufficient. This guide explains why the "hotspot problem" renders traditional extrusions obsolete and identifies phase-change heat pipe modules as the critical bridge to sustained AI performance. For hardware architects, transitioning from simple aluminum blocks to hybrid thermal architectures is the only way to eliminate thermal bottlenecks and secure compute ROI. Read More

GPU thermal throttling in AI clusters is a localized hotspot problem, not just a general heating issue. This guide identifies high-performance heat pipe spreading and direct-to-chip liquid cooling as the only viable paths for sustained 700W+ TDP loads. For hardware architects, the decision between advanced phase-change modules and microchannel waterblocks is the difference between peak computational yield and costly hardware throttling. Read More

In 2026, the key to successful thermal design is system optimization, not just peak benchmarks. This guide explains why the deep machining liquid cold plate is the ideal ROI choice for mid-power electronics like IGBTs and telecom gear. By prioritizing a one-piece aluminum structure over complex micro-fins, engineers can achieve sufficient cooling while minimizing pressure drop, leakage risks, and manufacturing lead times. Read More

In 2026, the thermal management market is divided between extreme AI cooling and standard industrial reliability. This article argues that for mid-power electronics like IGBTs and EV BMS, the deep machining liquid cold plate remains the superior economic choice. Its one-piece aluminum construction eliminates the high costs and leak risks of vacuum brazing, providing a simplified, rugged, and highly scalable thermal management solution for projects that prioritize long-term field stability over extreme thermal benchmarks. Read More

In the era of 100kW+ AI racks, the cold plate has evolved from a passive component to a critical performance limiter. This guide analyzes why traditional deep machining architectures—while ultra-reliable for CPUs and EVs—become a bottleneck for AI GPUs due to their inability to suppress localized hotspots. It provides a technical roadmap for transitioning from standard CNC machined plates to advanced micro-channel and jet-impingement systems to ensure maximum computational yield. Read More

While deep machining liquid cold plates offer unmatched leak resistance for industrial and EV power modules, their linear flow geometry cannot suppress the extreme localized hotspots of AI GPUs. This article evaluates the structural limitations of gun-drilled channels—specifically their lack of jet impingement and limited surface area—helping engineers determine when to transition from cost-effective monolithic plates to high-density micro-channel architectures to prevent thermal throttling. Read More

This guide defines the practical heat flux boundaries of deep machining liquid cold plates, demonstrating why their one-piece structure is ideal for mid-power loads but struggles against extreme AI-level densities. By comparing CNC aluminum and copper architectures against micro-channel alternatives, it equips engineering and procurement teams with the concrete parameters needed to specify the most reliable, cost-effective custom liquid cooling solution without over-engineering. Read More