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Aluminium BGA Heat Sink


BGA is a welding process, such as resistance welding on the motherboard, and the pins of the chip are welded on the motherboard. BGA's advanced high density packaging technology promotes the realization of the development goal of electronic products towards multi-function, high performance, miniaturization and lightening.

Kingka provides a series of BGA heat sink and thermal solutions for cooling IC and IC with ball gate array (BGA) surface mount packaging. 

BGA heat sinks are so named because they are mounted on a bga devices, so the heatsink installed on BGA device are called BGA heatsink, but they are actually simple aluminum extruded heat sink design to cooling the BGA device. bga heatsinks are usually cross-cut converted extruded fins into pins, which also know as cross fin heat sink , allowing them to be used in a wider range of applications. The number and size of crosscuts depends on the environment.

bga heat sink 1bga heat sink

Mobile: +86 13712444018
Tel: +86 (769) 87636775
E-mail Address(es):

Kingka Tech Industrial Limited, founded in 2010, is a professional aluminum alloy processing manufacturer specializing in precision CNC machining. King’s product range is from all kinds of heat sinks to structure parts. Our products are widely applied in telecom, aerospace, automotive, industrial control, power electronics, medical instrument, security electronics, LED lighting and multimedia/consumer etc. 


Add: Da Long New Village,Xie Gang Town, Dongguan City,Guangdong Province, China 523598
Tel: +86 (769) 87636775
Fax: +86 (769) 82797386
Contact Person: Kenny Jiang.

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