A C1100 copper plate is machined flat and grooved for the fin pitch. Aluminum fins are cut, inserted with thermal epoxy, and cured under load; the copper face is then fly-cut to restore flatness and can be nickel plated where the joint or the environment calls for it. The chamfer on the inlet fins is machined after bonding.
Copper only where the flux is highest.
Full copper face under the device.
Fits tight to a wall or duct edge.
For solderability and corrosion.
Flat contact restored after cure.
| Base Material | Copper C1100 base with bonded aluminum fins |
|---|---|
| Base Material | Copper C1100 |
| Base Thickness | 4-12 mm |
| Fin Material | Aluminum 6063 or 1050 |
| Inlet | Chamfered first fins for duct entry |
| Base CNC Tolerance | Milling / drilling / tapping down to +/-0.005 mm |
| Dimensional Inspection | Hexagon CMM +/-0.001 mm; 2.5D optical projector |
| Quality System | ISO 9001:2015; IATF 16949:2016 |
| Capacity | 60,000+ thermal parts per year |
| Lead Time | Samples typically 7-15 days; production scheduled to volume |
Note: values above are KingKa build options and verified capability; final geometry, holes and finish are confirmed against your drawing.
The copper-to-aluminum bond is the risk point: two metals with different expansion, joined by epoxy. Groove depth and cure profile are set so the bond line stays thin and does not creep under thermal cycling.
Design & CFD. 3D layout with CFD review sizes the fin field, pipe route and base thickness to the load and airflow.
Base machining. Plate, pockets and pipe channels are milled on 50+ CNC centers to +/-0.005 mm.
Fin and pipe joining. Fins skived, stacked or extruded; pipes pressed and soldered; the stack joined to the base by the process the design calls for.
Face fly-cutting. Contact face machined flat after joining so the part sits true on the device.
Final inspection. Hexagon CMM (+/-0.001 mm) and 2.5D projector check critical features; 4-stage IQC / IPQC / FQC.
Fin pitch and height - measured against the drawing before packing.
Base flatness - fly-cut face checked on the contact side.
CMM report - critical dimensions to +/-0.001 mm.
Joint inspection - solder or weld fillet checked along the stack feet.
Visual and batch audit - IQC / IPQC / FQC on every run.
A copper spreader pays off when the source is small and the load is high:
IGBT and SiC modules
Laser diode stacks
RF power amplifiers
Induction heating stages
High-flux test fixtures
Send the device footprint, the power and the coolant (air or liquid) plus the space around the part. KingKa sizes the copper thickness against the spread resistance, then sets fin pitch to the airflow.
KingKa is a direct manufacturer with 16+ years in thermal production, 50+ CNC centers, in-house skiving, FSW and vacuum brazing, certified to ISO 9001:2015 and IATF 16949:2016.
State the device footprint before the wattage - a 20 mm die on a 100 mm plate needs copper thickness, not more fins, and the quote changes with that answer.
One supplier for the whole assembly. Base, fins, pipes and hardware under one quality system.
CFD before tooling. Design review catches a bad layout before metal is cut.
Prototype to volume. Samples in 7-15 days, production scheduled to forecast.
