This article breaks down the essential elements influencing extruded heat sink performance, including alloy selection, fin geometry, spacing & height, surface treatments, base design, airflow optimization, and manufacturing tolerances, with practical insights from KINGKA’s expertise in custom thermal solutions. Read More

This article examines the practical applications of extruded heat sinks in automotive (ECUs, LED lighting, EV/hybrid systems) and electronics (processors/GPUs, power supplies, telecom/networking), highlighting design benefits, performance advantages, and customization for high-volume production, with KINGKA’s expertise in precision thermal solutions. Read More

This article breaks down the essential elements influencing extruded heat sink performance, including alloy selection, fin geometry, spacing & height, surface treatments, base design, airflow optimization, and manufacturing tolerances, with practical insights from KINGKA’s expertise in custom thermal solutions. Read More

Designing heat sinks for high-power applications often results in inadequate cooling, leading to component failures, reduced efficiency, and escalated downtime costs in industries like electronics and automotive. Basic profiles fail to handle dense heat fluxes, compounding these issues. High-perform Read More

Industrial processes generate excessive heat that can degrade equipment performance, increase failure rates, and drive up energy costs in sectors like manufacturing and power generation. Conventional cooling methods often lack scalability and efficiency, leading to suboptimal operations. Aluminum ex Read More

This technical article explores the critical engineering challenge of minimizing thermal resistance ($R_{th}$) in high-power AI compute nodes, where standard cooling solutions often fail. Authored by Kingka Tech’s engineering team, the post analyzes the physical limitations of standard extruded heat sinks and explains why advanced manufacturing processes—specifically Skived Fin and Bonded Fin technologies—are essential for cooling modern 500W+ GPUs. Read More

This article, written by Kingka Tech's engineering team, explores the critical trade-off between surface area and pressure drop in heat sink design. It details how to select the right manufacturing process—Skived, Extruded, or Bonded fins—based on application requirements like server cooling or automotive LEDs. The post leverages Kingka's 13 years of experience and 4000+ manufactured parts to provide actionable advice on material selection (Aluminum vs. Copper) and geometry optimization for B2B procurement managers. Read More

This article explores the engineering principles behind optimizing Multi-pass tube liquid cold plates for high-power electronics. Authored by Kingka Tech, a manufacturer with 10+ years of experience, the post details specific design strategies, including 4-Pass Copper Tube FSW layouts and 2-Pass Hi-Contact technologies. It analyzes the trade-offs between thermal uniformity and pressure drop, the benefits of Friction Stir Welding (FSW) for reliability, and material selection (Copper vs. Aluminum) to guide B2B buyers in selecting the right cooling solution. Read More

As data center power densities escalate, selecting the appropriate cooling architecture is critical for operational longevity and ROI. This guide, authored by Kingka Tech’s Chief Manufacturing Engineer, provides an objective, data-driven comparison between Cold Plate (Direct-to-Chip) and Immersion cooling technologies. We analyze key decision factors including Power Usage Effectiveness (PUE), infrastructure requirements, and maintenance complexity. The article highlights how Cold Plate technology offers a pragmatic path for retrofitting existing facilities, utilizing high-precision CNC machined micro-channels to target high-heat flux chips with surgical accuracy. By examining material compatibility, floor loading constraints, and Kingka Tech’s "zero-leak" reliability testing, this guide empowers procurement managers and engineers to choose the thermal solution that best balances performance, scalability, and total cost of ownership. Read More