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Copper/SUS Liquid Cold Plates

Our Copper/SUS Tube Liquid Cold Plates provide precision thermal management for high-power new energy systems. Featuring seamless tube-in-groove technology in CNC-machined copper or stainless steel bases, these cold plates ensure optimal heat dissipation for EV batteries, energy storage systems, and power electronics. Customizable flow paths, military-grade leak-proof designs, and dual-side cooling capabilities deliver 35% higher thermal efficiency than conventional solutions, maintaining critical components within ±1.5°C operating tolerance.
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Our SUS/Cu Tube Liquid Cold Plates deliver precision thermal management for new energy applications, including EV battery systems, energy storage solutions, and high-power electronic devices. Engineered for maximum heat dissipation efficiency, these cold plates feature joint-free embedded tubing technology in CNC-machined base plates.


Key Technical Specifications

  • Thermal Conductivity:

    • Copper: 380-400 W/m·K

    • Stainless Steel: 15-25 W/m·K

  • Working Pressure: ≤1.5 MPa (217 PSI)

  • Temperature Range: -40°C to +150°C

  • Leakage Rate: <1×10⁻⁸ Pa·m³/s (Helium Test)

  • Surface Flatness: ≤0.1mm/m²

  • Standard Sizes: 200×150mm to 600×400mm (Customizable)


Core Technologies

Multi-Material Compatibility

  • Base Plates: CNC-machined Aluminum 6061-T6 / Copper C1100

  • Cooling Tubes: Oxygen-Free Copper (C10100/C10200) or SUS 304/316L Stainless Steel

  • Interface Options: Thermal epoxy (≤5 W/m·K) or vacuum brazing

Enhanced Thermal Architectures

  • Single/Multi-Pass Tubing Designs

  • Parallel Microchannel Configurations (Φ3mm-Φ8mm tubes)

  • Dual-Side Cooling Capability

  • Press-Fit Tolerance: ≤0.05mm

Advanced Manufacturing

  • 5-axis CNC Groove Machining

  • Diffusion Welding for Leak-Free Joints

  • Surface Treatments: Ni/Au Plating or Anodizing (Aluminum)


Performance Advantages

35% Higher Heat Flux Density vs. Conventional Cold Plates
<0.02°C/W Thermal Resistance (Base-to-Fluid)
5000+ Thermal Cycling Reliability (MIL-STD-883)
IP67/IP69K Protection Grade Available
Custom Flow Path Optimization (CFD Simulation Supported)


Application-Specific Solutions

EV Battery Thermal Management Systems
Industrial Laser Cooling
Data Center Server Cooling
Renewable Energy Converters
5G Base Station Thermal Control


Certifications & Compliance

  • ISO 9001:2015 Quality System

  • IATF 16949 Automotive Standard

  • RoHS 3 & REACH Compliant

  • UL Fluid Compatibility Testing


Customization Services

Tube Layout Optimization (Serpentine/Parallel/Z-Type)
Integrated Temperature/Pressure Sensors
Quick-Connect Fluid Couplings (Parker/Hansfield compatible)
3D Contoured Surfaces for Component Integration


Why Choose Our Cold Plates?

Our cold plates combine aerospace-grade manufacturing with field-proven thermal designs, achieving 92%+ temperature uniformity across heating surfaces. The unique tube-in-groove architecture eliminates traditional welding weaknesses while maintaining a <0.5°C temperature gradient under 500W/cm² heat loads.


Request CFD Thermal Analysis Report

Contact our engineers for application-specific performance simulations and DFM guidelines.

Copper/SUS Liquid Cold Plates

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   Tel: +86 (769) 87636775 
   E-mail: sales2@kingkatech.com 
    Add: Da Long Add: New Village,Xie Gang Town, Dongguan City, Guangdong Province, China 523598
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