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Superior Thermal Conductivity: Made from high-quality copper, which has a thermal conductivity of approximately 400 W/m-K, ensuring efficient heat transfer.
Skived Fin Technology: Fins are precision-engineered using a skiving process that creates very thin, densely packed fins. This design enhances the surface area for maximum heat dissipation.
High Aspect Ratio: The heatsink can achieve an aspect ratio of up to 50, allowing for effective cooling in limited spaces.
Cost-Effective Manufacturing: Minimal tooling costs associated with the skiving process make it an economical choice for custom heatsinks.
Durability: An anti-oxidation surface treatment extends the lifespan of the heatsink, ensuring reliable performance over time.
The Copper CPU Skived Fin Heatsink is suitable for various applications, including:
Computers and Electronic Components: Ideal for cooling CPUs and GPUs in desktops and servers.
Telecommunication Equipment: Effective in managing heat in communication devices.
Industrial Equipment: Used in various industrial applications requiring efficient thermal management.
LED Lighting and Household Appliances: Provides cooling solutions for high-power lighting and appliances.
Automotive Components: Ensures reliable performance of automotive electronics.
Enhanced Cooling Performance: The combination of copper material and skived fin design provides superior thermal performance compared to traditional heatsinks.
Space Efficiency: The compact design allows for installation in tight spaces without compromising cooling efficiency.
Customizable Design: Available in various dimensions and configurations to meet specific application requirements.
For those seeking an effective solution to manage heat in high-performance applications, the Copper CPU Skived Fin Heatsink offers unparalleled efficiency and reliability. Its innovative design and high-quality materials make it a top choice for engineers and manufacturers alike. For custom designs or quotes, please contact us directly.
Superior Thermal Conductivity: Made from high-quality copper, which has a thermal conductivity of approximately 400 W/m-K, ensuring efficient heat transfer.
Skived Fin Technology: Fins are precision-engineered using a skiving process that creates very thin, densely packed fins. This design enhances the surface area for maximum heat dissipation.
High Aspect Ratio: The heatsink can achieve an aspect ratio of up to 50, allowing for effective cooling in limited spaces.
Cost-Effective Manufacturing: Minimal tooling costs associated with the skiving process make it an economical choice for custom heatsinks.
Durability: An anti-oxidation surface treatment extends the lifespan of the heatsink, ensuring reliable performance over time.
The Copper CPU Skived Fin Heatsink is suitable for various applications, including:
Computers and Electronic Components: Ideal for cooling CPUs and GPUs in desktops and servers.
Telecommunication Equipment: Effective in managing heat in communication devices.
Industrial Equipment: Used in various industrial applications requiring efficient thermal management.
LED Lighting and Household Appliances: Provides cooling solutions for high-power lighting and appliances.
Automotive Components: Ensures reliable performance of automotive electronics.
Enhanced Cooling Performance: The combination of copper material and skived fin design provides superior thermal performance compared to traditional heatsinks.
Space Efficiency: The compact design allows for installation in tight spaces without compromising cooling efficiency.
Customizable Design: Available in various dimensions and configurations to meet specific application requirements.
For those seeking an effective solution to manage heat in high-performance applications, the Copper CPU Skived Fin Heatsink offers unparalleled efficiency and reliability. Its innovative design and high-quality materials make it a top choice for engineers and manufacturers alike. For custom designs or quotes, please contact us directly.
