The profile is extruded in aluminium - copper where the spreading demand justifies it - then cut to length, machined for mounting holes and a flat contact face, and finished as-machined or anodized. Where a tighter fin pitch than a die can hold is needed, the same envelope is skived instead of extruded.
Matched to the IGBT operating range.
Copper or aluminium at chip level.
Profile chosen against the power level.
Pitch from the die, or skived if tighter.
Machined before assembly.
| Base Material | Extruded aluminum (copper on request) |
|---|---|
| Material | Extruded aluminum (copper on request) |
| Device Range | IGBT module, -40 to 150 C operating |
| Sizing | By simulation to the power level |
| Fin | Extruded straight fins |
| Base CNC Tolerance | Milling / drilling / tapping down to +/-0.005 mm |
| Dimensional Inspection | Hexagon CMM +/-0.001 mm; 2.5D optical projector |
| Quality System | ISO 9001:2015; IATF 16949:2016 |
| Capacity | 60,000+ thermal parts per year |
| Lead Time | Samples typically 7-15 days; production scheduled to volume |
Note: values above are KingKa build options and verified capability; final geometry, holes and finish are confirmed against your drawing.
IGBTs are moving toward large capacity, high frequency, low loss and modular packages - each step raises the heat flux at the same footprint, which is why the sink is now sized per module rather than per kilowatt.
Design & CFD. 3D layout with CFD review sizes the fin field, pipe route and base thickness to the load and airflow.
Base machining. Plate, pockets and pipe channels are milled on 50+ CNC centers to +/-0.005 mm.
Fin and pipe joining. Fins skived, stacked or extruded; pipes pressed and soldered; the stack joined to the base by the process the design calls for.
Face fly-cutting. Contact face machined flat after joining so the part sits true on the device.
Final inspection. Hexagon CMM (+/-0.001 mm) and 2.5D projector check critical features; 4-stage IQC / IPQC / FQC.
Fin pitch and height - measured against the drawing before packing.
Base flatness - fly-cut face checked on the contact side.
CMM report - critical dimensions to +/-0.001 mm.
Joint inspection - solder or weld fillet checked along the stack feet.
Visual and batch audit - IQC / IPQC / FQC on every run.
IGBT sinks are specified by device level:
Motor drives
Traction converters
Welding power supplies
Solar inverters
UPS and power stacks
Send the module outline, the power level and the switching loss. KingKa runs the thermal check, then picks a profile or a skived block and machines the fixing pattern.
KingKa is a direct manufacturer with 16+ years in thermal production, 50+ CNC centers, in-house skiving, FSW and vacuum brazing, certified to ISO 9001:2015 and IATF 16949:2016.
Give the module part number and the switching condition: two modules with the same current rating do not dissipate the same, and the sink follows the loss, not the label.
One supplier for the whole assembly. Base, fins, pipes and hardware under one quality system.
CFD before tooling. Design review catches a bad layout before metal is cut.
Prototype to volume. Samples in 7-15 days, production scheduled to forecast.
